- 专利标题： Semiconductor package with multiple stacked leadframes and a method of manufacturing the same
-
申请号： US15590878申请日： 2017-05-09
-
公开(公告)号： US10276477B1公开(公告)日： 2019-04-30
- 发明人: Saravuth Sirinorakul , Keith M. Edwards , Suebphong Yenrudee , Albert Loh
- 申请人： UTAC Headquarters PTE. LTD.
- 申请人地址： SG Singapore
- 专利权人： UTAC Headquarters PTE. LTD.
- 当前专利权人： UTAC Headquarters PTE. LTD.
- 当前专利权人地址： SG Singapore
- 代理机构： Haverstock & Owens LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/495 ; H01L23/31 ; H01L21/78
摘要：
Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple leadframe routing layers in a plated and etched copper terminal semiconductor package by removing unwanted areas of each leadframe to create conductive paths on an associated leadframe layer of the semiconductor package.
信息查询
IPC分类:
