A fingerprint identification apparatus includes a fingerprint identification IC chip having a contact face and a plurality of metal bumps arranged on the contact face, a thin substrate having a first face, a second face opposite to the first face and a plurality of metal pads arranged on the first face, wherein at least part of the metal pads electrically connect with the metal bumps, a protection layer having a mounting face adjacent to the second face of the thin substrate, and a plurality of conductive electrodes arranged between the thin substrate and the protection layer. The metal bumps are not directly pressed or press-soldered to the protection layer, thus preventing the transparent conductive traces of the protection layer from damaging and enhancing the package yield.