Invention Grant
- Patent Title: Semiconductor device structure with semiconductor wire
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Application No.: US15692188Application Date: 2017-08-31
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Publication No.: US10290548B2Publication Date: 2019-05-14
- Inventor: Hung-Li Chiang , I-Sheng Chen , Tzu-Chiang Chen , Tung-Ying Lee , Szu-Wei Huang , Huan-Sheng Wei
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L21/02 ; H01L29/04

Abstract:
Semiconductor device structures are provided. The semiconductor device structure includes a first semiconductor wire over a semiconductor substrate. The first semiconductor wire has a first width and a first thickness. The semiconductor device structure also includes a first gate stack surrounding the first semiconductor wire. The semiconductor device structure further includes a second semiconductor wire over the semiconductor substrate. The first semiconductor wire and the second semiconductor wire include different materials. The second semiconductor wire has a second width and a second thickness. The first width is greater than the second width. The first thickness is less than the second thickness. In addition, the semiconductor device structure includes a second gate stack surrounding the second semiconductor wire.
Public/Granted literature
- US20190067121A1 SEMICONDUCTOR DEVICE STRUCTURE WITH SEMICONDUCTOR WIRE Public/Granted day:2019-02-28
Information query
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