Invention Grant
- Patent Title: Method and apparatus for forming backside die planar devices and saw filter
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Application No.: US15323521Application Date: 2014-08-07
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Publication No.: US10290598B2Publication Date: 2019-05-14
- Inventor: Kevin J. Lee , Ruchir Saraswat , Uwe Zillmann , Nicholas P. Cowley , Richard J. Goldman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- International Application: PCT/US2014/050134 WO 20140807
- International Announcement: WO2016/022125 WO 20160211
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01F27/28 ; G06F1/16 ; H01L23/64 ; H01L23/522 ; H03H9/64 ; H03H7/42 ; H01L23/48 ; H01L23/66 ; H01L23/525
Abstract:
Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
Public/Granted literature
- US20170141058A1 METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER Public/Granted day:2017-05-18
Information query
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