Invention Grant
- Patent Title: Robust and high current smart-plug
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Application No.: US15412841Application Date: 2017-01-23
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Publication No.: US10291065B2Publication Date: 2019-05-14
- Inventor: Dick Kwai Chan , Kam Wai Lam , JZ Zheng , Wai Yin Shum , Brenton James Judge , Hamza Yilmaz , Patrick Yeung , Wai Ming Wu
- Applicant: Computime, Ltd.
- Applicant Address: HK New Territories
- Assignee: Computime, Ltd.
- Current Assignee: Computime, Ltd.
- Current Assignee Address: HK New Territories
- Agency: Banne & Witcoff, Ltd.
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H02J13/00 ; H05K1/02 ; H05K1/14 ; G01R21/133 ; H01R24/30 ; H01R24/78 ; H01R103/00 ; H05K1/11 ; H05K3/28

Abstract:
A smart plug that is partitioned into a plurality of printed circuit boards (PCBs) in a three dimensional manner to reduce its size. Aspects consider the effect of the possible increased internal temperature as the size of the smart plug is reduced. For example, thick metal foils connect various components of a smart plug to reduce heat dissipation within the smart plug. Also, a metal foil may transfer heat from contact metal on a PCB to a side wall of a plastic housing of the smart plug. The smart plug may comprise a computing device that obtains information identifying the attached electrical device and accesses device data about the time duration during which the attached electrical device exhibits transient characteristics. The computing device then uses the accessed data to effectively control the attached electrical device.
Public/Granted literature
- US20170288456A1 Robust and High Current Smart-Plug Public/Granted day:2017-10-05
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