Invention Grant
- Patent Title: High performance, flexible, and compact low-density parity-check (LDPC) code
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Application No.: US15622008Application Date: 2017-06-13
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Publication No.: US10291354B2Publication Date: 2019-05-14
- Inventor: Thomas Joseph Richardson , Shrinivas Kudekar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm IP Dept.
- Agent James Hunt Yancey, Jr.
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04L1/18 ; H03M13/03 ; H03M13/11 ; H03M13/00

Abstract:
Certain aspects of the present disclosure generally relate to techniques for puncturing of structured low-density parity-check (LDPC) codes. Certain aspects of the present disclosure generally relate to methods and apparatus for a high-performance, flexible, and compact LDPC code. Certain aspects can enable LDPC code designs to support large ranges of rates, blocklengths, and granularity, while being capable of fine incremental redundancy hybrid automatic repeat request (IR-HARQ) extension while maintaining good floor performance, a high-level of parallelism to deliver high throughout performance, and a low description complexity.
Public/Granted literature
- US20170359148A1 HIGH PERFORMANCE, FLEXIBLE, AND COMPACT LOW-DENSITY PARITY-CHECK (LDPC) CODE Public/Granted day:2017-12-14
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