Invention Grant
- Patent Title: Vertical shielding and interconnect for SIP modules
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Application No.: US15713705Application Date: 2017-09-25
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Publication No.: US10292258B2Publication Date: 2019-05-14
- Inventor: Lan H. Hoang , Takayoshi Katahira
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/28 ; H05K9/00 ; H05K1/14 ; H05K3/36 ; H05K3/40 ; H05K1/18 ; H01L21/48 ; H01L23/552 ; H01L25/065 ; H01L25/10 ; H01L25/11 ; H05K3/34 ; H01L23/29 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L25/16
Abstract:
Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.
Public/Granted literature
- US20180049311A1 VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES Public/Granted day:2018-02-15
Information query
