Invention Grant
- Patent Title: Apparatus for clamping a probe card and probe card including the same
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Application No.: US15407660Application Date: 2017-01-17
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Publication No.: US10295564B2Publication Date: 2019-05-21
- Inventor: Sung-Yong Park , Sang-Boo Kang , Jae-Geun Kim , Sung-Hyup Kim , Jeong-Min Na , Jae-Hyoung Park , Sang-Kyu Yoo , Jae-Hoon Joo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0090543 20160718
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R1/04 ; G01R31/28

Abstract:
An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.
Public/Granted literature
- US20180017595A1 APPARATUS FOR CLAMPING A PROBE CARD AND PROBE CARD INCLUDING THE SAME Public/Granted day:2018-01-18
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