Invention Grant
- Patent Title: Resin sheet for sealing electronic device and method for manufacturing electronic-device package
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Application No.: US15032105Application Date: 2014-10-03
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Publication No.: US10297470B2Publication Date: 2019-05-21
- Inventor: Yusaku Shimizu , Eiji Toyoda , Goji Shiga
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: JP2013-223208 20131028
- International Application: PCT/JP2014/076576 WO 20141003
- International Announcement: WO2015/064304 WO 20150507
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H03H9/64 ; H03H9/10 ; H01L23/00 ; H01L21/78 ; H01L23/29 ; H03H3/08 ; H01L23/31
Abstract:
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.
Public/Granted literature
- US20160269000A1 RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC-DEVICE PACKAGE Public/Granted day:2016-09-15
Information query
IPC分类:
