- 专利标题： Resin sheet for sealing electronic device and method for manufacturing electronic-device package
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申请号： US15032105申请日： 2014-10-03
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公开(公告)号： US10297470B2公开(公告)日： 2019-05-21
- 发明人: Yusaku Shimizu , Eiji Toyoda , Goji Shiga
- 申请人： NITTO DENKO CORPORATION
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 代理机构： Knobbe Martens Olson & Bear, LLP
- 优先权： JP2013-223208 20131028
- 国际申请： PCT/JP2014/076576 WO 20141003
- 国际公布： WO2015/064304 WO 20150507
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H03H9/64 ; H03H9/10 ; H01L23/00 ; H01L21/78 ; H01L23/29 ; H03H3/08 ; H01L23/31
摘要：
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.
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