Resin sheet for sealing electronic device and method for manufacturing electronic-device package
Abstract:
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.
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