Invention Grant
- Patent Title: Lead frame and method of producing a chip housing
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Application No.: US15541765Application Date: 2016-01-07
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Publication No.: US10297537B2Publication Date: 2019-05-21
- Inventor: Martin Brandl , Tobias Gebuhr
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102015100262 20150109
- International Application: PCT/EP2016/050221 WO 20160107
- International Announcement: WO2016/110545 WO 20160714
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L33/00 ; H01L33/62 ; H01L23/00 ; H01L33/48 ; H01L21/56

Abstract:
A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.
Public/Granted literature
- US20180005924A1 LEAD FRAME AND METHOD OF PRODUCING A CHIP HOUSING Public/Granted day:2018-01-04
Information query
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