Invention Grant
- Patent Title: Signal transmission apparatus including semiconductor chips and signal isolator
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Application No.: US15497189Application Date: 2017-04-25
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Publication No.: US10297538B2Publication Date: 2019-05-21
- Inventor: Osamu Tabata , Shuichi Nagai , Songbaek Choe
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2016-097468 20160513
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01F38/14 ; H01L23/522 ; H01L25/00 ; H01P1/201 ; H01P5/02 ; H04B5/00 ; H01L23/49 ; H01P1/203 ; H01L21/56 ; H01P7/08 ; H01L23/48
Abstract:
A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.
Public/Granted literature
- US20170330824A1 SIGNAL TRANSMISSION APPARATUS INCLUDING SEMICONDUCTOR CHIPS AND SIGNAL ISOLATOR Public/Granted day:2017-11-16
Information query
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