Invention Grant
- Patent Title: Reduced form factor radio frequency system-in-package
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Application No.: US15489607Application Date: 2017-04-17
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Publication No.: US10297576B2Publication Date: 2019-05-21
- Inventor: Darren Roger Frenette , George Khoury , Lori Ann DeOrio
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L25/065 ; H01L25/00 ; H04B1/40
Abstract:
A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.
Public/Granted literature
- US20170301655A1 REDUCED FORM FACTOR RADIO FREQUENCY SYSTEM-IN-PACKAGE Public/Granted day:2017-10-19
Information query
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