Invention Grant
- Patent Title: Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe
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Application No.: US15650323Application Date: 2017-07-14
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Publication No.: US10304751B2Publication Date: 2019-05-28
- Inventor: Andreas Grassmann , Juergen Hoegerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015104956 20150331
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/495 ; H01L23/498

Abstract:
An electronic sub-module includes a leadframe, a semiconductor chip disposed on the leadframe and an encapsulation material disposed on the leadframe and on the semiconductor chip. The semiconductor chip has a first contact pad on a first main face of the semiconductor chip. The sub-module also includes a first contact element on a first main face of the electronic sub-module. The first contact element is electrically connected with the first contact pad. A surface area of the first contact element is greater than a surface area of the first contact pad.
Public/Granted literature
- US20170316999A1 Electronic Sub-Module Including a Leadframe and a Semiconductor Chip Disposed on the Leadframe Public/Granted day:2017-11-02
Information query
IPC分类: