Invention Grant
- Patent Title: EMI shielding structure
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Application No.: US15789184Application Date: 2017-10-20
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Publication No.: US10306816B2Publication Date: 2019-05-28
- Inventor: Il-ju Mun , Keon Kuk , Ji-woon Yeom
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2017-0011671 20170125
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K9/00 ; H05K1/11 ; H05K1/18 ; H01L23/552 ; H05K3/40 ; H05K3/28 ; H05K3/32
Abstract:
An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.
Public/Granted literature
- US20180116078A1 EMI SHIELDING STRUCTURE Public/Granted day:2018-04-26
Information query
