Invention Grant
- Patent Title: Co-formed element with low conductivity layer
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Application No.: US14773945Application Date: 2013-12-30
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Publication No.: US10309230B2Publication Date: 2019-06-04
- Inventor: Michael G McCaffrey
- Applicant: UNITED TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Bachman & LaPointe, P.C.
- International Application: PCT/US2013/078187 WO 20131230
- International Announcement: WO2014/143364 WO 20140918
- Main IPC: B28B1/24
- IPC: B28B1/24 ; F01D5/14 ; F01D5/22 ; F01D5/28 ; F01D5/30 ; F01D9/04
Abstract:
A co-formed element includes a core structure which has a root portion and is formed from a high thermal conductivity ceramic matrix composite material, and a low thermal conductivity layer co-formed with the core structure and surrounding the root portion of the core structure.
Public/Granted literature
- US20160017723A1 Co-Formed Element with Low Conductivity Layer Public/Granted day:2016-01-21
Information query
