Invention Grant
- Patent Title: Package comprising switches and filters
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Application No.: US15235790Application Date: 2016-08-12
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Publication No.: US10312193B2Publication Date: 2019-06-04
- Inventor: Shiqun Gu , Chengjie Zuo , Steve Fanelli , Husnu Ahmet Masaracioglu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/538 ; H01L21/56 ; H01L21/768 ; H01L23/31 ; H01L23/66 ; H01L25/07 ; H01L25/00 ; H03H1/00 ; H01L21/48 ; H01L23/00 ; H01L23/498
Abstract:
A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.
Public/Granted literature
- US20180047673A1 PACKAGE COMPRISING SWITCHES AND FILTERS Public/Granted day:2018-02-15
Information query
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