Invention Grant
- Patent Title: Process and temperature compensation in TIA using dual replica and servo loop
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Application No.: US14997940Application Date: 2016-01-18
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Publication No.: US10312866B2Publication Date: 2019-06-04
- Inventor: Stefan Barabas , Joseph Balardeta , Simon Pang , Scott Denton
- Applicant: Luxtera, Inc.
- Applicant Address: US CA Carlsbad
- Assignee: Luxtera, Inc.
- Current Assignee: Luxtera, Inc.
- Current Assignee Address: US CA Carlsbad
- Agency: McAndrews, Held & Malloy
- Main IPC: H03F1/08
- IPC: H03F1/08 ; H03F1/30 ; H03F3/08 ; H03G3/30 ; H01L31/02 ; H01L31/09 ; H03F1/56

Abstract:
Methods and systems for process and temperature compensation in a transimpedance amplifier using a dual replica and servo loop is disclosed and may include a transimpedance amplifier (TIA) circuit comprising a first TIA, a second TIA, a third TIA, and a control loop. The first TIA comprises a fixed feedback resistance and the second and third TIAs each comprise a configurable feedback impedance. The control loop comprises a gain stage with inputs coupled to outputs of the first and second TIAs and with an output coupled to the configurable feedback impedance of the second and third TIAs. The circuit may be operable to configure a gain level of the first TIA based on the fixed feedback resistance and a reference current applied at an input to the first TIA, and configure a gain level of the second and third TIAs based on a control voltage generated by the gain stage.
Public/Granted literature
- US20160211807A1 Process and Temperature Compensation in TIA Using Dual Replica and Servo Loop Public/Granted day:2016-07-21
Information query
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