发明授权
- 专利标题： Heat dissipating structures and mobility apparatus for electronic headset frames
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申请号： US16112733申请日： 2018-08-26
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公开(公告)号： US10317942B1公开(公告)日： 2019-06-11
- 发明人: Guy A Mascaro , Mark Gamache , Matthew Kevin Walsh
- 申请人： Guy A Mascaro , Mark Gamache , Matthew Kevin Walsh
- 申请人地址： US IN Indianapolis
- 专利权人： HODEI TECHNOLOGY, LLC
- 当前专利权人： HODEI TECHNOLOGY, LLC
- 当前专利权人地址： US IN Indianapolis
- 代理机构： Roberts IP Law
- 代理商 John Roberts
- 主分类号： G06F1/16
- IPC分类号： G06F1/16 ; G06F1/20
摘要：
A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.
信息查询
