Invention Grant
- Patent Title: Hinge mechanism for a computing device
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Application No.: US15748224Application Date: 2015-11-12
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Publication No.: US10317951B2Publication Date: 2019-06-11
- Inventor: Mark Senatori
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2015/060380 WO 20151112
- International Announcement: WO2017/082910 WO 20170518
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16

Abstract:
Examples disclosed herein provide a hinge mechanism to couple housings of a computing device. As an example, the hinge mechanism includes a first guide rail fixed to a first housing of the computing device, a second guide rail fixed to a second housing of the computing device, and an intermediate guide rail to connect the first and second guide rails to each other. As an example, the hinge mechanism includes clamping brackets to hold the first, second, and immediate guide rails together and apply rotational friction to the hinge mechanism so that the first and second housings can be positioned at various angles with respect to each other.
Public/Granted literature
- US20180224900A1 HINGE MECHANISM FOR A COMPUTING DEVICE Public/Granted day:2018-08-09
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