Invention Grant
- Patent Title: Method of three-dimensional optoelectrical simulation of image sensor
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Application No.: US14254337Application Date: 2014-04-16
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Publication No.: US10318678B2Publication Date: 2019-06-11
- Inventor: Wook Lee , Han-Gu Kim , Young-Keun Lee , Jong-Sung Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0043664 20130419
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A three-dimensional optoelectrical simulation includes generating a process simulation result including a doping profile of a silicon substrate of image sensor, a structure simulation result with respect to a back end of line structure, and a merged result generated by merging a process simulation result and a structure simulation result, selectively extending the merged result to an extended result by using a process simulation result or a structure simulation result, generating a segmented result for each pixel based on a merged result or an extended result, an optical crosstalk simulation result of image sensor based on a structure simulation result and an optical mesh, and a final simulation result including an electrical crosstalk simulation result of the image sensor based on a segmented result for each pixel and an optical crosstalk simulation result.
Public/Granted literature
- US20140316760A1 METHOD OF THREE-DIMENSIONAL OPTOELECTRICAL SIMULATION OF IMAGE SENSOR Public/Granted day:2014-10-23
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