发明授权
- 专利标题： Circuit package having a plurality of epoxy mold compounds with different compositions
-
申请号： US15546846申请日： 2015-03-27
-
公开(公告)号： US10319657B2公开(公告)日： 2019-06-11
- 发明人: Chien-Hua Chen , Michael W Cumbie
- 申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 申请人地址： US TX Spring
- 专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址： US TX Spring
- 代理机构： HP Inc. Patent Department
- 国际申请： PCT/US2015/023049 WO 20150327
- 国际公布： WO2016/159937 WO 20161006
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L21/00 ; H01L23/31 ; H01L21/56 ; B81B7/00 ; H01L23/373 ; H01L23/00
摘要：
A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.
公开/授权文献
- US20180025960A1 CIRCUIT PACKAGE 公开/授权日：2018-01-25
信息查询
IPC分类:
