Invention Grant
- Patent Title: Leveler, leveler composition and method for electrodeposition of metals in microelectronics
-
Application No.: US15181469Application Date: 2016-06-14
-
Publication No.: US10323015B2Publication Date: 2019-06-18
- Inventor: Yun Zhang , Tao Ma , Peipei Dong , Zifang Zhu , Chen Chen
- Applicant: Shinhao Materials LLC
- Applicant Address: CN Wujiang
- Assignee: Shinhao Materials LLC
- Current Assignee: Shinhao Materials LLC
- Current Assignee Address: CN Wujiang
- Agency: SZDC Law P.C.
- Main IPC: C07D311/84
- IPC: C07D311/84 ; C07D311/86 ; C25D3/38 ; C25D7/12 ; C25D3/22 ; C25D3/32 ; C25D3/46 ; C25D3/54
Abstract:
The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof:
Public/Granted literature
- US20170029400A1 Leveler, Leveler Composition and Method for Electrodeposition of Metals in Microelectronics Public/Granted day:2017-02-02
Information query
