- 专利标题： Dual temperature heater
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申请号： US14875392申请日： 2015-10-05
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公开(公告)号： US10325799B2公开(公告)日： 2019-06-18
- 发明人: Dale R. Du Bois , Juan Carlos Rocha-Alvarez , Sanjeev Baluja , Ganesh Balasubramanian , Lipyeow Yap , Jianhua Zhou , Thomas Nowak
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson + Sheridan
- 主分类号： B05C13/00
- IPC分类号： B05C13/00 ; H01L21/68 ; C23C16/458 ; H01J37/32 ; H01L21/687 ; H01L21/324 ; H01L21/67
摘要：
A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering members for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering members are movably disposed along a periphery of the support surface, and each of the plurality of centering members comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.
公开/授权文献
- US20160093521A1 DUAL TEMPERATURE HEATER 公开/授权日：2016-03-31
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