Invention Grant
- Patent Title: Fluid manifold
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Application No.: US15747419Application Date: 2015-10-12
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Publication No.: US10328695B2Publication Date: 2019-06-25
- Inventor: Silam J. Choy
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/055147 WO 20151012
- International Announcement: WO2017/065739 WO 20170420
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/155 ; B33Y30/00

Abstract:
A fluid manifold may include a number of blades and a number of end pieces securing the blades in place wherein the fluid manifold interfaces between a printhead die and a number of fluid source slots. A method of manufacturing a fluid manifold may include arranging a number of metal blades to form a relatively larger pitch between blades on a bottom side of the arranged blades than on a top side the arranged blades and mounting the arranged blades to a mounting structure formed to receive each blade as arranged.
Public/Granted literature
- US20180215152A1 FLUID MANIFOLD Public/Granted day:2018-08-02
Information query
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