Invention Grant
- Patent Title: Inner resistive film with ductile particles and outer resistive film
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Application No.: US15973980Application Date: 2018-05-08
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Publication No.: US10331055B2Publication Date: 2019-06-25
- Inventor: Thomas Anthony , Seongsik Chang , Omer Gila
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Michael A Dryja
- Main IPC: G03G15/02
- IPC: G03G15/02 ; B41F31/26 ; G03G15/08

Abstract:
An inner resistive film is applied to a conductive substrate. Ductile particles are disposed substantially uniformly throughout the inner resistive film. An outer resistive film is applied to the inner resistive film.
Public/Granted literature
- US20180259870A1 INNER RESISTIVE FILM WITH DUCTILE PARTICLES AND OUTER RESISTIVE FILM Public/Granted day:2018-09-13
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