Invention Grant
- Patent Title: Electromagnetic component and fabrication method thereof
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Application No.: US14621409Application Date: 2015-02-13
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Publication No.: US10332669B2Publication Date: 2019-06-25
- Inventor: Wei-Chien Chang , Chia-Chi Wu , Lang-Yi Chiang , Tsung-Chan Wu , Jih-Hsu Yeh
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/02 ; H01F5/00 ; H01F27/29 ; H01F41/04 ; H01F17/04
Abstract:
An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.
Public/Granted literature
- US20150155091A1 ELECTROMAGNETIC COMPONENT AND FABRICATION METHOD THEREOF Public/Granted day:2015-06-04
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