Invention Grant
- Patent Title: Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
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Application No.: US15604992Application Date: 2017-05-25
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Publication No.: US10333019B2Publication Date: 2019-06-25
- Inventor: Junli Shentu , Jiaming Ye
- Applicant: Silergy Semiconductor Technology (Hangzhou) Ltd.
- Applicant Address: CN Hangzhou
- Assignee: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
- Current Assignee: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
- Current Assignee Address: CN Hangzhou
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201610367262 20160527
- Main IPC: H01L31/167
- IPC: H01L31/167 ; H01L31/0216 ; H01L31/0203 ; H01L31/02 ; H01L31/18 ; G01J5/10 ; G01J1/42 ; G01J1/02 ; G01J1/04 ; H01L31/00
Abstract:
A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.
Public/Granted literature
- US20170345961A1 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-11-30
Information query
IPC分类:
