Invention Grant
- Patent Title: Wireless power transfer using direct field penetration through a metal object
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Application No.: US15167680Application Date: 2016-05-27
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Publication No.: US10333350B2Publication Date: 2019-06-25
- Inventor: Randy Standke , Seong Heon Jeong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H02J7/00 ; H02J7/02 ; H04B5/00 ; H01Q13/10 ; H02J50/10 ; H02J50/12 ; H02J50/80
Abstract:
An apparatus for wireless power reception in an electronic device may include a casing configured to house electronic components of the electronic device. The casing may include a non-conductive support substrate and a metal layer disposed on the support substrate. The apparatus may include a power receiving element configured to magnetically couple to an externally generated magnetic field to produce power for one or more of the electronic components of the electronic device.
Public/Granted literature
- US20160352151A1 WIRELESS POWER TRANSFER USING DIRECT FIELD PENETRATION THROUGH A METAL OBJECT Public/Granted day:2016-12-01
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