A filter package and method of manufacturing thereof is disclosed. The filter device package includes a first dielectric layer having an acoustic wave filter device attached thereto, the acoustic wave filter device comprising an active area and I/O pads. The filter device package also includes an adhesive positioned between the first dielectric layer and the acoustic wave filter device to secure the layer to the device, vias formed through the first dielectric layer and the adhesive to the I/O pads of the acoustic wave filter device, and metal interconnects formed in the vias and mechanically and electrically coupled to the I/O pads of the acoustic wave filter device to form electrical interconnections thereto, wherein an air cavity is formed in the adhesive between the acoustic wave filter device and the first dielectric layer, in a location adjacent the active area of the acoustic wave filter device.