Invention Grant
- Patent Title: Method and apparatus for dual connectivity
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Application No.: US14903172Application Date: 2013-07-30
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Publication No.: US10334608B2Publication Date: 2019-06-25
- Inventor: Yixue Lei , Haipeng Lei , Zhi Zhang , Liu Yang
- Applicant: Nokia Technologies Oy
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- International Application: PCT/CN2013/080403 WO 20130730
- International Announcement: WO2015/013881 WO 20150205
- Main IPC: H04W72/08
- IPC: H04W72/08 ; H04W36/02 ; H04W36/30 ; H04W76/15 ; H04W92/20 ; H04W36/00
Abstract:
A method and apparatus can be configured to determine a redundancy rate. The method can also include mirroring an amount of data from a first node to a second node based upon the determined redundancy rate. The method can also include transmitting a last-data-unit index or a next-data-unit index.
Public/Granted literature
- US20160150586A1 METHOD AND APPARATUS FOR DUAL CONNECTIVITY Public/Granted day:2016-05-26
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