Invention Grant
- Patent Title: Multilayer capacitor and installation structure of multilayer capacitor
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Application No.: US15713785Application Date: 2017-09-25
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Publication No.: US10340085B2Publication Date: 2019-07-02
- Inventor: Sui Uno , Takashi Sawada , Yohei Mukobata
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-164920 20140813
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/012

Abstract:
In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.
Public/Granted literature
- US20180012705A1 MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR Public/Granted day:2018-01-11
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