Invention Grant
- Patent Title: Thin-film capacitor
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Application No.: US15899403Application Date: 2018-02-20
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Publication No.: US10340088B2Publication Date: 2019-07-02
- Inventor: Koichi Tsunoda , Mitsuhiro Tomikawa , Kazuhiro Yoshikawa , Kenichi Yoshida
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-030028 20170221
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G9/04 ; H01G9/07 ; H01G9/012 ; H01G2/02 ; H01G4/224 ; H01G4/228

Abstract:
In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.
Public/Granted literature
- US20180240599A1 THIN-FILM CAPACITOR Public/Granted day:2018-08-23
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