Invention Grant
- Patent Title: Power amplification module, front-end circuit, and communication device
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Application No.: US15941078Application Date: 2018-03-30
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Publication No.: US10340971B2Publication Date: 2019-07-02
- Inventor: Hidenori Obiya , Reiji Nakajima , Shinya Hitomi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2015-197198 20151002
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/40 ; H03F3/195 ; H04B1/00 ; H03F1/56 ; H03F3/19 ; H03F3/24 ; H03F3/72 ; H04B1/18 ; H04B1/48

Abstract:
A PA module (10A) includes a previous stage amplification element (12) to amplify a high-frequency signal, a posterior stage amplification element (13) to amplify the high-frequency signal amplified by the previous stage amplification element (12), and a variable filter circuit arranged between the previous stage amplification element (12) and the posterior stage amplification element (13) to vary a pass band and an attenuation band in accordance with a frequency band of the high-frequency signal, in which the variable filter circuit includes a filter portion (16) and switches (14 and 15) to vary the pass band and the attenuation band of the variable filter circuit, and the previous stage amplification element (12) and at least a part of the switches (14 and 15) are formed in one chip using a chip A, the posterior stage amplification element (13) are included in a second chip which is different from the chip A.
Public/Granted literature
- US20180227008A1 POWER AMPLIFICATION MODULE, FRONT-END CIRCUIT, AND COMMUNICATION DEVICE Public/Granted day:2018-08-09
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