Invention Grant
- Patent Title: Coil electronic component and method for manufacturing the same
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Application No.: US15391216Application Date: 2016-12-27
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Publication No.: US10347419B2Publication Date: 2019-07-09
- Inventor: Jae Hun Kim , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius, LLP
- Priority: KR10-2016-0064200 20160525
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F41/04 ; H01F17/00 ; H01F17/04
Abstract:
A coil electronic component includes: a body including a substrate and coil parts disposed on first and second surfaces of the substrate; and external electrodes formed on outer surfaces of the body and connected to the coil parts. A metal layer is disposed within the substrate.
Public/Granted literature
- US20170345556A1 COIL ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-11-30
Information query
