Invention Grant
- Patent Title: Leadframe package with stable extended leads
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Application No.: US15801022Application Date: 2017-11-01
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Publication No.: US10347569B2Publication Date: 2019-07-09
- Inventor: Jefferson Talledo
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/29

Abstract:
Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.
Public/Granted literature
- US20180068932A1 LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS Public/Granted day:2018-03-08
Information query
IPC分类: