- 专利标题： Package substrate and semiconductor package including the same
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申请号： US15709947申请日： 2017-09-20
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公开(公告)号： US10347576B2公开(公告)日： 2019-07-09
- 发明人: Kwang-Won Choi , Sang-Woo Pae , Seong-Won Jeong , Min-Jae Kwon , Da-Hye Min , Jin-Chul Park , Jae-Won Chang
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Lee & Morse, P.C.
- 优先权： KR10-2016-0122022 20160923
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/053 ; H01L23/13 ; H01L23/20 ; H01L23/24 ; H01L23/31 ; H01L23/00 ; H01L23/16 ; H01L21/56
摘要：
A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.
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