Invention Grant
- Patent Title: Signal delivery and antenna layout using flexible printed circuit board (PCB)
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Application No.: US15415145Application Date: 2017-01-25
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Publication No.: US10347967B2Publication Date: 2019-07-09
- Inventor: Elimelech Ganchrow , Alon Yehezkely
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/22 ; H04B7/02 ; G06F3/00 ; H01Q1/24 ; H01Q9/28

Abstract:
Certain aspects of the present disclosure relate to methods and apparatus for wireless communication, and more particularly, to using a flexible printed circuit board (PCB) to convey signals between a radio frequency (RF) module and a baseband module. The flexible PCB can then be used as a medium for deploying antennas or creating arrays of multiple RF modules.
Public/Granted literature
- US20170214121A1 SIGNAL DELIVERY AND ANTENNA LAYOUT USING FLEXIBLE PRINTED CIRCUIT BOARD (PCB) Public/Granted day:2017-07-27
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