发明授权
- 专利标题： Substrate-mounted connector for electronic devices and manufacturing method thereof
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申请号： US15822363申请日： 2017-11-27
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公开(公告)号： US10348012B2公开(公告)日： 2019-07-09
- 发明人: Shukuyo Yamada , Masaya Hirashima , Tsuyoshi Kozai
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： JP Minato-ku
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Minato-ku
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2017-119818 20170619
- 主分类号： H01R12/00
- IPC分类号： H01R12/00 ; H05K1/00 ; H01R12/70 ; H01R43/18 ; H01R43/20 ; H01R4/02 ; H01R13/6585 ; H01R12/72 ; H01R13/405 ; H01R24/60
摘要：
According to one embodiment, a connector includes an insulator and a contact terminal in which an end side is pressed into a counter-press-fit portion of the insulator, and the other end side comprises a soldered portion attached to a substrate with soldering. The contact terminal comprises a flux accumulation portion inside the counter-press-fit portion and/or in an extended end portion of the soldered portion.
公开/授权文献
- US20180366849A1 CONNECTOR AND MANUFACTURING METHOD THEREOF 公开/授权日：2018-12-20
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