Invention Grant
- Patent Title: Electronic apparatus and manufacturing method of electronic apparatus
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Application No.: US15554262Application Date: 2015-12-24
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Publication No.: US10348349B2Publication Date: 2019-07-09
- Inventor: Takahiro Kondo , Masaki Nakamoto
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Infrastructure Systems & Solutions Corporation
- Applicant Address: JP Minato-ku JP Kawasaki-shi
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Infrastructure Systems & Solutions Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Infrastructure Systems & Solutions Corporation
- Current Assignee Address: JP Minato-ku JP Kawasaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-099384 20150514
- International Application: PCT/JP2015/085978 WO 20151224
- International Announcement: WO2016/181582 WO 20161117
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H04B1/3827 ; H01Q1/12 ; H04B1/38

Abstract:
An electronic apparatus of an embodiment includes a movable housing, a main housing, a joint, a cable, and a seal structure. The joint includes a connection portion connected to the movable housing, and a fixed portion connected to the main housing. The cable extends from an inside of the movable housing to an inside of the main housing through an inside of the connection portion and an inside of the fixed portion. The seal structure seals between the movable housing and the connection portion, and seals between the main housing and the fixed portions.
Public/Granted literature
- US20180062683A1 ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS Public/Granted day:2018-03-01
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