A camera system including an objective, an objective holder carrying the objective, an image sensor and a printed circuit board. The printed circuit board and the image sensor are connected to one another in an electronically conductive manner, and the image sensor and the objective are arranged such that an image is n focus on the image sensor. The printed circuit board has a circuit layer made of an electrically insulating material and a printed circuit board substrate, wherein the printed circuit board substrate is manufactured from a material with a coefficient of thermal expansion aL which deviates by no more than 30% from the coefficient of thermal expansion of a material from which the objective holder is manufactured.