The invention relates to: a method for adhesively bonding two substrates, in which a first substrate, which contains a thermoplastic, is transported by way of at least one supporting conveyor belt through a heating zone in which the surface of said substrate is softened, and then the second substrate, which has an adhesive layer, is laminated onto the softened surface of the first substrate and pressed together therewith; a composite body obtainable in this manner, in which the two substrates are bonded by a flexible, thin adhesive layer; and a device for adhesively bonding these two substrates by means of the described method.