- 专利标题: Run-time correction of defect locations during defect review
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申请号: US12781532申请日: 2010-05-17
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公开(公告)号: US10354405B2公开(公告)日: 2019-07-16
- 发明人: Jeong Ho Lee
- 申请人: Jeong Ho Lee
- 申请人地址: US CA Milpitas
- 专利权人: KLA-TENCOR CORPORATION
- 当前专利权人: KLA-TENCOR CORPORATION
- 当前专利权人地址: US CA Milpitas
- 代理机构: Okamoto & Benedicto LLP
- 主分类号: G06T7/73
- IPC分类号: G06T7/73 ; G06T7/30 ; G06T3/00
摘要:
One embodiment relates to a method for run-time correction of defect locations on a substrate during defect review. The substrate is loaded into a stage of a review apparatus, and coordinates for the defect locations on the substrate is received. The defect locations are grouped, and at least one local reference site in proximity to each group of defect locations is determined. The local reference site(s) is (are) used to determine a positional offset for the defect locations in each group. Another embodiment relates to an apparatus for reviewing defect locations on a substrate which provides for run-time correction of the defect locations. Other embodiments and features are also disclosed.
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