- 专利标题: Compound semiconductor substrate with SiC layer
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申请号: US15761841申请日: 2016-10-17
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公开(公告)号: US10354864B2公开(公告)日: 2019-07-16
- 发明人: Mitsuhisa Narukawa , Akira Fukazawa , Hiroki Suzuki , Keisuke Kawamura
- 申请人: AIR WATER INC.
- 申请人地址: JP Hokkaido
- 专利权人: Air Water Inc.
- 当前专利权人: Air Water Inc.
- 当前专利权人地址: JP Hokkaido
- 代理机构: Wood, Phillips, Katz, Clark & Mortimer
- 优先权: JP2015-207258 20151021
- 国际申请: PCT/JP2016/080702 WO 20161017
- 国际公布: WO2017/069087 WO 20170427
- 主分类号: H01L31/0328
- IPC分类号: H01L31/0328 ; H01L31/0336 ; H01L21/02 ; C23C16/34 ; H01L29/778 ; H01L29/812 ; H01L33/32 ; H01L29/10 ; H01L29/20 ; H01L29/205 ; H01L29/66
摘要:
A compound semiconductor substrate having a desired quality is provided.A compound semiconductor substrate has an SiC (silicon carbide) layer, an AlN (aluminum nitride) buffer layer formed on the SiC layer, an Al (aluminum) nitride semiconductor layer formed on the AlN buffer layer, a first GaN (gallium nitride) layer formed on the Al nitride semiconductor layer, a first AlN intermediate layer formed on the first GaN layer in contact with the first GaN layer, and a second GaN layer formed on the first AlN intermediate layer in contact with the first AlN intermediate layer.
公开/授权文献
- US20180277363A1 COMPOUND SEMICONDUCTOR SUBSTRATE WITH SiC LAYER 公开/授权日:2018-09-27
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