发明授权
- 专利标题： Adhesion layer forming method, adhesion layer forming system and recording medium
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申请号： US15077988申请日： 2016-03-23
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公开(公告)号： US10354915B2公开(公告)日： 2019-07-16
- 发明人: Tomohisa Hoshino , Masato Hamada , Takashi Tanaka , Yuichiro Inatomi , Yusuke Saito
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Pearne & Gordon LLP
- 优先权： JP2015-064582 20150326
- 主分类号： B05D3/12
- IPC分类号： B05D3/12 ; H01L21/70 ; H01L21/768 ; H01L21/67 ; C23C18/18 ; H01L21/288 ; B05D1/00 ; C23C18/16 ; C23C18/32 ; C23C18/38 ; C23C18/50
摘要：
An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.
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