Invention Grant
- Patent Title: Metal pillar in a film-type semiconductor package
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Application No.: US15456882Application Date: 2017-03-13
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Publication No.: US10354967B2Publication Date: 2019-07-16
- Inventor: Jung-woo Kim , Woon-bae Kim , Bo-in Noh , Go-woon Seong , Ji-yong Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0125590 20160929
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; H01L23/00
Abstract:
A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.
Public/Granted literature
- US20180090459A1 FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-29
Information query
IPC分类:
