- 专利标题: Semiconductor device
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申请号: US15243522申请日: 2016-08-22
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公开(公告)号: US10355078B2公开(公告)日: 2019-07-16
- 发明人: Hiroshi Kono , Takuma Suzuki
- 申请人: KABUSHIKI KAISHA TOSHIBA
- 申请人地址: JP Tokyo
- 专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址: JP Tokyo
- 代理机构: Kim & Stewart LLP
- 优先权: JP2016-053104 20160316
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/10 ; H01L29/16 ; H01L29/78
摘要:
A device includes a silicon carbide layer between first and second electrodes. The silicon carbide layer includes first region, second region between the first region and second electrode, and third region between the second region and second electrode. The device includes first and second trenches, through the second and third regions and terminating within the first region, having a layer formed thereon, and spaced by portions of the second and third regions. The silicon carbide layer includes fourth region between the third region and first trench, and fifth region between the third region and second trench. The second region includes a fourth portion between first and second portions, and a fifth portion between second and third portions. The first, second, and third portions have lower impurity than the fourth and fifth portions, and the fourth and fifth portions extend closer to the first electrode than do the other portions.
公开/授权文献
- US20170271437A1 SEMICONDUCTOR DEVICE 公开/授权日:2017-09-21
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