Invention Grant
- Patent Title: 3D semiconductor device with stacked memory
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Application No.: US15727592Application Date: 2017-10-07
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Publication No.: US10355121B2Publication Date: 2019-07-16
- Inventor: Zvi Or-Bach , Yuniarto Widjaja
- Applicant: Monolithic 3D Inc.
- Applicant Address: US CA San Jose
- Assignee: MONOLITHIC 3D INC.
- Current Assignee: MONOLITHIC 3D INC.
- Current Assignee Address: US CA San Jose
- Agency: Tran & Associates
- Main IPC: H01L29/78
- IPC: H01L29/78 ; G11C16/02 ; H01L27/115 ; G11C11/404 ; G11C11/4097 ; H01L27/108 ; H01L27/11 ; H01L27/11578 ; H01L27/24 ; G11C11/412 ; G11C16/04

Abstract:
A semiconductor device, the device including: a first stratum including memory periphery circuits; a second stratum including an array of first memory cells, where the first stratum is overlaid by the second stratum; a third stratum including an array of second memory cells, where the second stratum is overlaid by the third stratum, where the first memory cells include a plurality of first polysilicon structures and the second memory cells include a plurality of second polysilicon structures, and where at least one of the first memory cells is self-aligned to at least one of the second memory cells.
Public/Granted literature
- US20180033881A1 3DIC DEVICE WITH MEMORY Public/Granted day:2018-02-01
Information query
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