Invention Grant
- Patent Title: Vapor deposition mask, frame-equipped vapor deposition mask, and method for producing organic semiconductor element
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Application No.: US15719683Application Date: 2017-09-29
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Publication No.: US10355209B2Publication Date: 2019-07-16
- Inventor: Toshihiko Takeda , Katsunari Obata , Hiroshi Kawasaki
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Shonjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shonjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2013-235711 20131114; JP2014-207030 20141008
- Main IPC: H01L51/00
- IPC: H01L51/00 ; C23C14/24 ; H01L51/56 ; C23C14/04 ; C23C16/04
Abstract:
A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.
Public/Granted literature
Information query
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