Invention Grant
- Patent Title: Printed circuit board with inner layer and outer layers and method of manufacturing the same
-
Application No.: US15142484Application Date: 2016-04-29
-
Publication No.: US10356916B2Publication Date: 2019-07-16
- Inventor: Han Kim , Sang Yul Ha , Sung Han Kim , Kyung Ho Lee , Seok Hwan Ahn , Myung Sam Kang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0092258 20150629; KR10-2015-0127220 20150908
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46 ; H05K1/05 ; H05K1/11 ; H05K3/00 ; H05K3/12
Abstract:
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.
Public/Granted literature
- US20160381791A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-12-29
Information query
